Tagged heterogeneous integration · show all articles
Bond pitch has kept halving on schedule and two vendors just ran a live cross-vendor chiplet link for the first time, while capacity races to keep up with demand. This turns those signals into dated, falsifiable scenarios for where packaging stands by 2035.
A floorplan for a multi-die package is a set of decisions made about dies you did not design. UCIe settles the electrical socket between them; floorplanning, thermal-mechanical co-design, and known-good-die testing still have to settle everything else.
A "chip" that ships today is often several dies stitched together after the fact. Here is how that stitching actually works — the interposers, the bonds, the standard that lets the dies talk, the stress that decides survival.
A larger single die should, in principle, be faster. It is also exponentially more likely to contain a fatal defect. This briefing works through the actual yield arithmetic behind the industry's shift to chiplets.