Equation 5 · Part 6 · Comparing the Main Approaches to Chiplets and Advanced Packaging
=
=
What this part means
The expressions on both sides represent the same quantity under the stated assumptions.
Its job in the formula
The equals sign connects the complete expression on the left with the complete expression on the right. Both sides must have compatible units.
Full expression→=→Article meaning
The passage around this formula
The bill for that proximity arrives as heat, and it arrives in a specific, structural way rather than as a vague “3D runs hotter” intuition. A stack has exactly one face in contact with the package’s heat-removal path — typically the topmost die, under a lid or heat spreader — so the temperature rise at a given tier depends on everything the heat has to cross to reach that face: . where P is the power dissipated at that tier and each is the thermal resistance of one layer already between that tier and the heat sink — die bulk, bonding interface, or an intervening active tier. A tier two layers from the heat-removal face inherits the resistance of…
Learn the underlying idea
An equals sign says that the expression on its left and the expression on its right have the same value under the stated definitions and assumptions.
Open the illustrated equality: what the equals sign claims guide →
Sources cited in the article section
- [6] Chiplets: Piecing Together the Next Generation of Chips (Part I) ↗
- [11] Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators ↗
These citations provide research context; check each source for the exact claim it supports.