#OSAT

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$A single diced die caught being placed onto a packaging substrate on a bright assembly bench, the die still a fraction above its landing position, the substrate's other sites already populated$

AI Hardware & Semiconductors

ASE Technology Finishes the Chip TSMC Started

A finished wafer isn't a sellable product. Someone still has to cut it, package it, and test it — and the largest company doing that job, ASE Technology, holds nearly half the entire advanced-packaging market.

By Brecht Corbeel · August 10, 2026 · 4 min read

A regional site map pinned to a bright office wall showing two campus footprints near each other, one labelled as a wafer fab and the other as a packaging campus, a connecting line caught being drawn between them

AI Hardware & Semiconductors

Amkor Is Building America's First Complete Chip Supply Chain

TSMC is building the wafer fab. Amkor is building the packaging plant next door — the piece that would let a chip go from raw silicon to finished, tested product without ever leaving the country.

By Brecht Corbeel · August 10, 2026 · 4 min read

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