Symbol Y_package
ackage is part of the quantity the equation computes from the expression on the right.
Read this term in its guide →Published equation contexts
Why this formula appears here
The arithmetic behind that claim is a plain probability composition, and it is worth writing down because it is the one piece of real math in advanced packaging that most design reviews skip past. If each of n chiplets bonded into one package has an independent per-die yield , the assembly’s final yield is approximately . which is a first-order model — it assumes bonding introduces no additional defects and that die yields are independent, both of which are simplifications addressed separately below. Even under this optimistic assumption, four chiplets each yielding 95% compose to roughly 81% assembly yield, and a twenty-die stack at the same per-die yield falls to…
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Symbol i
i appears in the bound of this product. The bound states where the repeated operation starts, ends, or which values it includes.
Read this term in its guide →Symbol n
n appears in the bound of this product. The bound states where the repeated operation starts, ends, or which values it includes.
Read this term in its guide →Starting index or lower bound: i=1
This label says where the repeated addition, multiplication, or accumulation starts. Read its value or condition together with the article’s description of the index.
Read this term in its guide →Ending index or upper bound: n
This label says where the repeated addition, multiplication, or accumulation stops. It sets the last term or end of the range.
Read this term in its guide →How to interpret it
Its accuracy depends on the assumptions and range of use described in the article. Read it with the definitions, units, and assumptions supplied by the article.
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Published contexts (1)
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Equation 3 · Semiconductors
Chiplets and Advanced Packaging in Practice: An Advanced Technical Guide
This equation gives an approximation: it relates the quantities while allowing an approximation.
The arithmetic behind that claim is a plain probability composition, and it is worth writing down because it is the one piece of real math in advanced packaging that most design reviews skip past. If each of n chiplets bonded into one package has an independent per-die yield , the assembly’s final yield is approximately . which is a first-order model — it assumes bonding introduces no additional defects and that die yields are independent, both of which are simplifications addressed separately below. Even under this optimistic assumption, four chiplets each yielding 95% compose to roughly 81% assembly yield, and a twenty-die stack at the same per-die yield falls to…