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not as 1/p . imec’s demonstrated step from 400-nanometre to 200-nanometre hybrid-bond pitch [ 4 , 3 ] is therefore not a doubling of achievable interconnect density but close to a quadrupling of it — the reason pitch numbers that look like modest, incremental reductions on a roadmap chart translate into much larger jumps in how many independent signals a bonded pair of dies can actually exchange per square millimetre.
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Equation 7 · AI Hardware & Semiconductors
How Chiplets and Advanced Packaging Actually Work
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not as 1/p . imec’s demonstrated step from 400-nanometre to 200-nanometre hybrid-bond pitch [ 4 , 3 ] is therefore not a doubling of achievable interconnect density but close to a quadrupling of it — the reason pitch numbers that look like modest, incremental reductions on a roadmap chart translate into much larger jumps in how many independent signals a bonded pair of dies can actually exchange per square millimetre.