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Equation 10 · When the Substrate Became the Product

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ℓ\ell

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Within its range of validity, the model explains the entire strategy of advanced packaging. Shorten ℓ\ell and you reduce the wire term. Reduce the connector pitch and you shrink CfixC_{\mathrm{fix}} per wire while getting more wires per millimetre of die edge, so you can lower the per-wire data rate for the same aggregate bandwidth — and a lower rate lets you drop the swing and delete the equalisation circuitry. The gains compound, which is why the reported numbers for short-reach parallel interfaces are so far below what a long-reach serial link costs.

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