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Equation 1 · Part 3 · When the Substrate Became the Product

Symbol D_0

Y(A)=(1+D0Ac)−c,Y(A) = \left(1 + \frac{D_0 A}{c}\right)^{-c},
D0D_0

What this part means

the defect density.

Its job in the formula

D0D_0 occurs above the fraction bar. The numerator is divided by the entire denominator below it.

Where the article explains it

with defect density D0D_0 , die area A , and a clustering parameter c that captures the fact that defects are not independently scattered [ 2 ] .

The passage around this formula

…that a given die contains none of them falls as its area grows. Feng and Ma, in the cost model they published for multi-chiplet architectures, use the negative binomial form Y(A)=(1+D0Ac)−cY(A) = \left(1 + \frac{D_0 A}{c}\right)^{-c}. with defect density D0D_0 , die area A , and a clustering parameter c that captures the fact that defects are not independently scattered [ 2 ] . The exact parameters matter less than the shape. Yield falls monotonically with area, so cost per good die rises faster than area, and past some size the marginal square…

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Learn the underlying idea

A subscript is a label attached below a symbol. It often selects a time step, component, category, or member of a sequence.

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Sources cited in the surrounding passage

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