Equation 21 · What an AI Accelerator Actually Is: Silicon, Packaging, and the Memory It Can Reach
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High-bandwidth memory takes the other branch. DRAM dies are stacked vertically and connected by through-silicon vias into a single cube, and that cube is placed on a silicon interposer immediately beside the processor die, so the memory interface becomes extremely wide and extremely short. The trade is width for distance: thousands of parallel connections running millimetres instead of hundreds running centimetres. The consequence is a step change in that no amount of board-level engineering could deliver.
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