Equation 6 · Part 2 · How Chiplets and Advanced Packaging Actually Work
Symbol p
What this part means
the pitch.
Its job in the formula
p occurs below the fraction bar. The quantity above the bar is divided by this expression; zero is excluded as a denominator.
Full expression→Symbol p→Article meaning
Where the article explains it
If interconnects sit on a roughly square grid of pitch p , the number that fit per unit area scales as .
The passage around this formula
Density itself is worth being precise about, because pitch and area density do not scale the same way. If interconnects sit on a roughly square grid of pitch p , the number that fit per unit area scales as . not as 1/p . imec’s demonstrated step from 400-nanometre to 200-nanometre hybrid-bond pitch [ 4 , 3 ] is therefore not a doubling of achievable interconnect density but close to a quadrupling of it — the reason pitch numbers that look like modest, incremental reductions on a roadmap chart translate into much larger jumps in how many independent signals a bonded pair of dies can actually exchange per square millimetre.
Learn the underlying idea
A variable is a named place for a value. Its letter is a local label: x can mean position in one formula and a data point in another.
Open the illustrated variables: a letter stands for a value guide →
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Sources cited in the article section
- [11] Copper Dual Damascene for Wafer-Level Packaging: Enabling Reliable, High-Density Interconnects ↗
- [8] A RF Redundant TSV Interconnection for High Resistance Si Interposer ↗
These citations provide research context; check each source for the exact claim it supports.