Equation 5 · How Chiplets and Advanced Packaging Actually Work
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the pitch. Read the equation part by part below; each part has a contextual explanation and a link to its mathematical background.
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Density itself is worth being precise about, because pitch and area density do not scale the same way. If interconnects sit on a roughly square grid of pitch p , the number that fit per unit area scales as
Sources cited in the article section
- [11] Copper Dual Damascene for Wafer-Level Packaging: Enabling Reliable, High-Density Interconnects ↗
- [8] A RF Redundant TSV Interconnection for High Resistance Si Interposer ↗
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