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Equation 1 · Part 5 · How Chiplets and Advanced Packaging Actually Work

Symbol r_i

Cox′  =  2πεoxln⁡ ⁣(ro/ri),C'_{\text{ox}} \;=\; \frac{2\pi\varepsilon_{\text{ox}}}{\ln\!\left(r_{\text{o}}/r_{\text{i}}\right)},
rir_{\text{i}}

What this part means

the via’s metal radius.

Its job in the formula

rir_i occurs below the fraction bar. The quantity above the bar is divided by this expression; zero is excluded as a denominator.

Where the article explains it

with rir_i the via’s metal radius, ror_o the outer radius of the oxide liner, and εox\varepsilon_{\text{ox}} the liner’s permittivity, while the bulk silicon beyond it contributes a finite shunt resistance rather than an open circuit.

The passage around this formula

Making the layer flat and fine is a fabrication problem; what that layer then does to a signal is a separate, electrical one, and a through-silicon via is a genuinely awkward electrical object because it is not just a wire — it is a metal core wrapped in a thin insulating liner, sitting inside bulk silicon that is a fairly poor but not negligible conductor in its own right. Treated as a coaxial structure — copper core, oxide liner, conductive silicon beyond it — the liner behaves as a capacitor per unit length, Cox′  =  2πεoxln⁡ ⁣(ro/ri)C'_{\text{ox}} \;=\; \frac{2\pi\varepsilon_{\text{ox}}}{\ln\!\left(r_{\text{o}}/r_{\text{i}}\right)}. with rir_i the via’s metal radius, ror_o the outer radius of the oxide liner, and εox\varepsilon_{\text{ox}} the liner’s permittivity, while the bulk silicon beyond it…

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Learn the underlying idea

A subscript is a label attached below a symbol. It often selects a time step, component, category, or member of a sequence.

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Sources cited in the surrounding passage

These citations provide research context; check each source for the exact claim it supports.