Equation 7 · Part 1 · Comparing the Main Approaches to Chiplets and Advanced Packaging
Symbol R_th,i
What this part means
the thermal resistance of one layer already between that tier and the heat sink — die bulk, bonding interface, or an intervening active tier.
Its job in the formula
h,i is a part of this expression. Its role is fixed by the surrounding article and by the operations shown in the formula.
Full expression→Symbol R_th,i→Article meaning
Where the article explains it
where P is the power dissipated at that tier and each is the thermal resistance of one layer already between that tier and the heat sink — die bulk, bonding interface, or an intervening active tier.
The passage around this formula
where P is the power dissipated at that tier and each is the thermal resistance of one layer already between that tier and the heat sink — die bulk, bonding interface, or an intervening active tier. A tier two layers from the heat-removal face inherits the resistance of everything below it in a way a single die never does, which is why thermal co-design and power-tier placement, not raw stack height, are what determine whether a given 3D design is thermally viable.
Learn the underlying idea
A subscript is a label attached below a symbol. It often selects a time step, component, category, or member of a sequence.
Open the illustrated subscripts: which member of a family? guide →
See this notation across published equations →
Sources cited in the article section
- [6] Chiplets: Piecing Together the Next Generation of Chips (Part I) ↗
- [11] Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators ↗
These citations provide research context; check each source for the exact claim it supports.