Equation 4 · Comparing the Main Approaches to Chiplets and Advanced Packaging
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the data rate carried by a single connection. Read the equation part by part below; each part has a contextual explanation and a link to its mathematical background.
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subscript
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where is the data rate carried by a single connection. The relationship is quadratic in pitch, not linear: halving the pitch alone — with no change to the per-connection data rate — quadruples the number of connections available in the same area, and therefore roughly quadruples aggregate bandwidth density. That is why the packaging industry has spent so much engineering effort on pitch specifically, rather than on pushing more current or a faster signal through the connections that already exist: geometry, not signalling rate, is the cheapest source of additional bandwidth once a joint is already short and direct.
Sources cited in the article section
- [6] Chiplets: Piecing Together the Next Generation of Chips (Part I) ↗
- [11] Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators ↗
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