Equation 3 · Comparing the Main Approaches to Chiplets and Advanced Packaging
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Shortening the electrical path this way has a direct, quantifiable effect on how much bandwidth a given joint area can carry. Treating the joint as a grid of independent connections at pitch p , each connection occupying roughly of area, gives a first-order areal bandwidth density . where is the data rate carried by a single connection. The relationship is quadratic in pitch, not linear: halving the pitch alone — with no change to the per-connection data rate — quadruples the number of connections available in the same area, and therefore roughly quadruples aggregate bandwidth density. That is why the packaging industry has spent so much engineering effort on pitch…
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Shortening the electrical path this way has a direct, quantifiable effect on how much bandwidth a given joint area can carry. Treating the joint as a grid of independent connections at pitch p , each connection occupying roughly of area, gives a first-order areal bandwidth density . where is the data rate carried by a single connection. The relationship is quadratic in pitch, not linear: halving the pitch alone — with no change to the per-connection data rate — quadruples the number of connections available in the same area, and therefore roughly quadruples aggregate bandwidth density. That is why the packaging industry has spent so much engineering effort on pitch specifically, rather than on pushing more current or a faster signal through the connections that already exist: geometry, not signalling rate, is the cheapest source of additional bandwidth once a joint is already short and direct.
Sources cited in the article section
- [6] Chiplets: Piecing Together the Next Generation of Chips (Part I) ↗
- [11] Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators ↗
These citations give research context. Read each source to check which claims it supports.
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