Equation 1 · Comparing the Main Approaches to Chiplets and Advanced Packaging
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the pitch. Read the equation part by part below; each part has a contextual explanation and a link to its mathematical background.
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Shortening the electrical path this way has a direct, quantifiable effect on how much bandwidth a given joint area can carry. Treating the joint as a grid of independent connections at pitch p , each connection occupying roughly of area, gives a first-order areal bandwidth density
Sources cited in the article section
- [6] Chiplets: Piecing Together the Next Generation of Chips (Part I) ↗
- [11] Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators ↗
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