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where $\mathcal{P}$ is a candidate placement of dies on the carrier, WL is total interconnect wirelength, $T_{\max}$ is peak steady-state junction temperature anywhere in the assembly, and $\sigma_{\max}$ is peak mechanical stress at any bonded interface. This is a schematic statement of the shape these tools optimize, not a reproduction of any one paper’s exact formula, but it makes the practitioner point concrete: whichever of $\alpha$ , $\beta$ , and $\gamma$ a design team weights most heavily determines where dies actually land, and a floorplan tuned only for WL is optimizing a real but incomplete objective.

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