Equation 1 · Part 8 · Chiplets and Advanced Packaging in Practice: Floorplanning, UCIe, and Thermal Co-Design
Symbol sigma_max
What this part means
peak mechanical stress at any bonded interface.
Its job in the formula
sigmax appears in the objective or constraint used by the optimization on the right.
Full expression→Symbol sigma_max→Article meaning
Where the article explains it
where is a candidate placement of dies on the carrier, WL is total interconnect wirelength, is peak steady-state junction temperature anywhere in the assembly, and is peak mechanical stress at any bonded interface.
The passage around this formula
…a single term: . where is a candidate placement of dies on the carrier, WL is total interconnect wirelength, is peak steady-state junction temperature anywhere in the assembly, and is peak mechanical stress at any bonded interface. This is a schematic statement of the shape these tools optimize, not a reproduction of any one paper’s exact formula, but it makes the practitioner point concrete: whichever of , , and a design team weights most…
Learn the underlying idea
A subscript is a label attached below a symbol. It often selects a time step, component, category, or member of a sequence.
Open the illustrated subscripts: which member of a family? guide →
See this notation across published equations →
Sources cited in the article section
- [5] TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems ↗
- [4] STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration ↗
- [6] Simultaneous Multi-die Floorplanning and Technology Assignment ↗
These citations provide research context; check each source for the exact claim it supports.