Equation 1 · Chiplets and Advanced Packaging in 2035: Scenarios, Signals, and Falsifiable Predictions
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the pitch. Read the equation part by part below; each part has a contextual explanation and a link to its mathematical background.
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What the article says around this equation
Analysis. The physical reason pitch matters this much is a simple scaling relationship worth making explicit. For interconnects arranged on a roughly square grid at pitch p , the number of connections available per unit of bonding area scales as
Sources cited in the article section
- [12] Summary of ECTC 2025 Special Session on Hybrid Bonding ↗
- [11] YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding ↗
- [10] Low Distortion Fusion Bonding using Pneumatically Warped Wafers ↗
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