Equation 3 · Advanced Semiconductor Fabrication in Practice: An Advanced Technical Guide
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A finished, fully-processed 300-millimeter wafer at an advanced node carries somewhere in the neighborhood of several hundred to a few thousand individual dies, and not all of them will work. The simplest model process engineers reach for treats random defects as a Poisson process across the wafer: given an average defect density (critical defects per unit area) and a die’s critical area (the area within which a defect is actually fatal to that die’s function), the expected fraction of working die is
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