#supply chain analysis

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A thermal-compression bonder mid-cycle on a partially built HBM stack, its bonding head caught lowered onto the topmost die with a queue of unstacked dies waiting on a tray beside it

The HBM Memory Supercycle: A Quantitative Look at Pricing, Yield, and the Consumer Spillover

Per-stack HBM pricing has risen 150% across three generations. DRAM contract prices moved 60-70% in a single quarter. This briefing works through the mechanics that connect a memory-stacking bottleneck to a consumer laptop price tag.

By Brecht Corbeel · August 10, 2026 · 4 min read

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