#AMD EPYC

Tagged AMD EPYC · show all articles

$A long glass-topped specimen case in a bright archive room holding a ceramic multichip module, a diced silicon interposer, and a lidded multi-die processor package in foam-lined trays, with one tray at the case's far end still empty and a new chiplet sample held a fraction above it$

AI Hardware & Semiconductors

From Origins to Frontier: A History of Chiplets and Advanced Packaging

IBM was gluing a hundred chips to one ceramic block in 1980, decades before chiplet was an industry word. This is the dated, sourced record of how packaging got from there to a ten-company standard written in 2022.

By Brecht Corbeel · October 3, 2026 · 18 min read

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